✕
✕
✕
Flanged Copper Base with Blind Hole

Flanged Copper Base with Blind Hole

Flanged copper base with blind hole, engineered for ultrasonic welding, ensuring stable current flow and secure mechanical retention in power modules.

 

    • Material: TU1 (C1020), T2 (C1100) Oxygen-Free Copper

    • Pad Diameter (D): ¢1.8–2.5mm

    • Pad Thickness (T): 0.3–0.5mm

    • Shank Diameter (D1): ¢1.1–1.5mm

    • Total Length (L): 2.5–5mm

    • Inner Hole Diameter (d): ¢0.7–0.9mm

    • Hole Depth (L1): 2.5–5mm

    • Welding Method: Ultrasonic Welding

    • Surface Treatment: Polishing – Pickling – Passivation
    • Configuration Types: Single/Double Blind Hole; Single/Double Through Hole
Contact Us

Design & Materials

 

This flanged copper base features a precision blind-hole structure, specifically designed to improve energy transfer and joint stability during ultrasonic welding.
Manufactured from TU1 (C1020) or T2 (C1100) oxygen-free copper, it delivers low electrical resistance and excellent plasticity for consistent weld formation.
The controlled blind-hole diameter and depth enhance mechanical interlocking, improving pull-out strength and connection repeatability in automated assembly lines.
Surface treatments including polishing, pickling, and passivation ensure clean weld interfaces, corrosion resistance, and long-term electrical reliability.

                               

 

Assembly PIN

 

Applications & Features

 

Designed for IGBT power modules, traction inverters, and industrial power electronics, this blind-hole terminal supports high-current transmission in compact module layouts.
The blind-hole geometry optimizes ultrasonic energy concentration, enabling strong solid-state bonds without solder or flux.
Validated in series applications for CRRC, StarPower, Chiplink, and Infineon Germany, where stable conductivity, welding consistency, and long service life are critical.

 

FAQs

 

Q: Why choose a blind-hole terminal instead of a through-hole design?

A: Blind-hole designs improve ultrasonic energy efficiency, reduce deformation risk, and provide higher pull-out strength in compact power module structures.

 

Q: Is the blind-hole structure customizable?

A: Yes. Blind-hole diameter, depth, and flange size can be customized to match your conductor size and welding parameters.

 

Q: What welding process is this terminal designed for?

A: It is optimized for ultrasonic welding, enabling stable metallurgical bonding without solder, heat input, or additional consumables.

Related products

✕

Contact Us