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Assembly Pin
Assembly Pin - Image 2

Assembly Pin

Assembly Pin designed for stable soldering and reliable electrical connection in IGBT power modules and high-current electronic assemblies.

 

  • Solder Pad Diameter: 1.7-1.8mm

  • Base Outer Diameter: 1.1-1.3mm

  • Base Height: 2.9mm

  • Pin Material: CuSn4 / CuSn6 / H65

  • Base Material: CuSn4 / C14500 / 3604

  • Plating: Gold plating over nickel underlayer: 1-3μm

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Design & Materials

 

Engineered for stable electrical performance and reliable soldering, this Assembly Pin combines optimized material selection with precise structural design to support high-current, high-density power modules.
 
Material Specifications
The pin is manufactured from CuSn4, CuSn6, or H65 copper alloys to ensure excellent conductivity and mechanical strength.
The base is available in CuSn4, C14500, or 3604, providing consistent solderability and structural stability during assembly.
 

Technical Specifications

 

Designed for compact layouts and repeatable assembly, the dimensions are tightly controlled to meet power module integration requirements.

Solder pad diameter: 1.7–1.8 mm

Base outer diameter: 1.1–1.3 mm

Base height: 2.9 mm

 

Assembly PIN

 

Applications & Features

 

Precision assembly components.

    • IGBT power modules

    • Power supplies & inverters

    • Industrial control electronics

    • High-current PCB assemblies

    • Energy storage & power conversion systems

 

FAQs

 

Q: Can Assembly Pins be customized for my power module design?

A: Yes. We customize pin diameter, base height, material combination, and plating thickness based on your electrical load, PCB layout, and assembly process requirements.

 

Q: Why use gold plating over a nickel underlayer?

A: The nickel layer improves adhesion and prevents copper diffusion, while gold plating ensures low contact resistance, oxidation resistance, and long-term electrical stability, especially in high-reliability power modules.

 

Q: What applications are these Assembly Pins best suited for?

A: They are commonly used in IGBT power modules, power supplies, inverters, industrial control equipment, and high-current electronic assemblies where stable interconnection is critical.

 

Q: What is your MOQ and lead time for Assembly Pins?

A: MOQ depends on the material and structure. Typical MOQs start from 10K pieces, with standard lead times of 4–6 weeks after drawing and specification confirmation.

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