Press-Fit Pin

Design & Materials

Designed for secure press-fit performance, these pins are available in hollow and solid structures, allowing precise control of insertion force and contact stability.

Manufactured from phosphor bronze, brass, copper-nickel-silicon, or BeCu, the pins balance conductivity, elasticity, and long-term mechanical reliability.
Surface finishes include matte tin (0.5–2 μm) or nickel (1–2 μm), ensuring stable contact resistance and compatibility with automated assembly.

Applications & Features

Versatile Press-Fit Solutions

Engineered to support both low-current signal transmission and high-current power connections, our press-fit pins adapt easily to different IGBT module and power electronics designs.

Signal Pin

Optimized for low-current and control signal paths, signal pins ensure consistent contact pressure, low resistance, and stable signal integrity under thermal cycling.

Power Pin

Designed for high-current load paths, power pins provide strong mechanical retention and reliable electrical conductivity, supporting efficient energy transfer in power modules and inverters.

FAQs

Q: What is the difference between hollow and solid press-fit pins?

A: Hollow pins offer better elasticity and controlled insertion force, while solid pins provide higher mechanical strength for demanding power applications.

Q: Can I customize pin thickness and material?

A: Yes. Thickness options include 0.5 mm, 0.64 mm, 0.8 mm, and 1.0 mm, with multiple copper alloy material choices available for customization.

Q: Are these press-fit pins suitable for IGBT power modules?

A: Absolutely. They are widely used in IGBT power modules, inverters, and power electronics requiring stable, solder-free connections.

Q: What surface plating options do you offer?

A: We offer matte tin and nickel plating to meet different electrical, environmental, and assembly requirements.