Copper Baseplate
High-purity copper baseplate with precision machining and controlled nickel plating, engineered for efficient heat dissipation in power module applications.
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Length: 104.7+0.1mm or Customized
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Width: 44.5+0.1mm or Customized
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Thickness: 3+0.1mm / 2-4mm
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Raw Material: C19210, C1100, Tu1 or Customized
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Plating: Ni: 2.5-12um
Design & Materials
This copper baseplate is designed to deliver reliable thermal conduction and structural stability in high-power electronic assemblies. Material selection is optimized for both heat transfer efficiency and long-term reliability.
Raw Material Options
Manufactured using C19210, C1100, or Tu1 copper, with full material customization available to meet specific electrical and thermal requirements.
Applications & Features
Designed for demanding power electronics environments where thermal performance and precision directly impact system reliability.
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Precision-engineered copper baseplates for efficient heat dissipation
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Customized dimensions to match specific module layouts
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High-precision tolerances for stable assembly and thermal interface performance
FAQs
Q: Can the copper baseplate dimensions be customized?
A: Yes. Length, width, and thickness can be fully customized to match your power module or inverter design requirements.
Q: What copper materials do you offer?
A: Standard options include C19210, C1100, and Tu1. Other copper grades are available upon request.
Q: What plating options are available?
A: We apply nickel plating from 2.5–12 μm to improve corrosion resistance, surface stability, and long-term thermal performance.
Q: What applications is this baseplate designed for?
A: It is widely used in IGBT power modules, inverters, energy storage systems, and high-power industrial electronics.
